What is BGA Full Form in Computer?
The BGA full form in computer is Ball Grid Array. Intel offers a device package known as the Ball-Grid Array. In BGA packages, the I/O connections are located on the device’s inside, which improves the pin count to board area ratio. Typical BGA packages include up to twice as many connections as quad flat pack packages for the same area. Further, BGA solder balls are substantially tougher than QFP leads, resulting in sturdy packages that can endure rigorous handling.
Important features of BGA in computing:
There are many important features of BGA. Unlike standard pin-based IC packages, which use leads or pins, BGA packages include an array of small solder balls organized in a grid on the underside of the chip. These balls act as the connection points to the PCB. BGA packaging is popular in modern electronics due to its small size, which saves space on the PCB and makes it perfect for small, high-density components like CPUs, GPUs, and flash memory.
Applications of BGA in computers:
BGA packaging is widely utilized for current CPUs, GPUs, and SoCs (System-on-Chip) in products such as laptops, cellphones, and gaming consoles. BGA packages are commonly used for components like as RAM and flash memory (for example, NAND flash). Ball Grid Array is widely employed in embedded systems due to its compact design and strong performance requirements.